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NXP Semiconductors
IP4350CX24
9-channel SD memory card interface ESD protection ?lter
10. Soldering of WLCSP packages
10.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount re?ow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
10.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The re?ow soldering itself
10.3 Re?ow soldering
Key characteristics in re?ow soldering are:
? Lead-free versus SnPb soldering; note that a lead-free re?ow process usually leads to
higher minimum peak temperatures (see Figure 13 ) than a PbSn process, thus
reducing the process window
? Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
? Re?ow temperature pro?le; this pro?le includes preheat, re?ow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classi?ed in accordance with Table 7 .
Table 7.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package re?ow temperature ( ° C)
Volume (mm 3 )
< 350
350 to 2000
> 2000
< 1.6
1.6 to 2.5
> 2.5
260
260
250
260
250
245
260
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during re?ow
soldering, see Figure 13 .
IP4350CX24_1
? NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 5 February 2010
11 of 16
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